During the firing process of ceramic base, precise control of the temperature curve is the key to avoiding cracking and deformation.

In the preparation of aluminum nitride substrate, the application of vacuum freeze-drying technology needs to be combined with process parameter optimization.

Precision grinding, with every millimeter's difference, safeguards the trust within the micron.

As semiconductor manufacturing progresses toward smaller, faster, and more powerful devices, wafer-level packaging and flip-chip bonding have become critical pathways for improving integration density and electrical performance.

In the microscopic world of microelectronics and advanced manufacturing technology, aluminum nitride substrates, with their exceptional physical and chemical properties

In modern precision manufacturing, screws are the most fundamental and smallest connecting components. Innovations in their performance and materials often trigger chain reactions throughout the industry.